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In power electronics high-performance power modules such as IGBTs (Insulated-Gate Bipolar Transistors) and IPMs (Intelligent Power Modules) are being manufactured increasingly frequently through the use of ultrasonic welding. In contrast to conventional soldering, the ultrasonic welding of the load-current and control connections offers comprehensive monitoring of the process and of quality. In reliability tests ultrasonically-welded power modules achieve approximately a tenfold longer service life. The substance-to-substance bond results in significantly reduced power loss at the points of contact, thus increasing the degree of electrical efficiency and minimizing the need for cooling.


Cu-Terminals onto DBC substrate

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Cu-Terminals onto gold coated DBC substrate

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Safteymodul for the automtive industry

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IGBT power modul with ultrasonic welded powercontact

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Pulse inverter with ultrasonic welded powercontact

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IGBT power modul with ultrasonic welded powercontact

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Leadframe modul with Cu contact onto DBC substrate

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DBC substrate with ultrasonic welded shunt

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Cu contact with ultrasonic welded shunt

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IGBT power modul with ultrasonic welded powercontact

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IGBT power modul with ultrasonic welded powercontact

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